Low profile printed circuit board

The present invention provides a low-profile printed circuit board including a substrate having at least one planar magnetic element supported thereon. The element includes a planar winding integral with the conductive circuit formed on either one or the other side of the board, and electrical commu...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	GRENNAN, MICHAEL J, GODEK, PAUL W
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDUCTANCES MAGNETS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES TRANSFORMERS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The present invention provides a low-profile printed circuit board including a substrate having at least one planar magnetic element supported thereon. The element includes a planar winding integral with the conductive circuit formed on either one or the other side of the board, and electrical communication is made from one side of the board to the other side via plated through holes provided in the substrate. Additional planar windings may be surface mounted to the winding carried by the substrate. A dielectric coating is also provided which completely isolates the winding of the planar magnetic element.