Thermally enhanced semiconductor chip package

A structure and method is disclosed for cooling a semiconductor computer chip module. The semiconductor computer chip module is made up of a plurality of semiconductor chips bonded together In one aspect of the present invention every other chip is staggered such that recesses are formed between protruding edges of every other chip along two opposite faces of the chip module. The opposite faces with the staggered chips are capped and sealed so that coolant channels are formed between the recesses and the sealing caps. In another aspect, one face of the chip module is bonded by a plurality of connectors to a base. The base and chip module with connectors form a chamber. The chamber is sealed and an opening is made in the base to circulate coolant into and around the connectors of the base and up along the coolant channels which are in fluid communication with the base. Thermal vias are provided between selected connectors and the chip module to conduct heat from the chips of the module to the connectors.