IC card including multiple substrates bearing electronic components

An IC card includes a main substrate and a plurality of sub-substrates. Each sub-substrate has two surfaces on which electronic components are installed. The sub-substrates are mounted on both surfaces of the main substrate within the IC card. Openings in the main substrate receive electronic compon...

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Bibliographische Detailangaben
Hauptverfasser:	ONODA, SHIGEO, ARITA, TAKASHI, NISHINO, KIYOTAKA, OKIDONO, TAKAAKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BOOK COVERS BOOKBINDING CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDEDFOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILES HANDLING RECORD CARRIERS LOOSE LEAVES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MOVABLE-STRIP WRITING OR READING APPARATUS PERFORMING OPERATIONS PHYSICS PRESENTATION OF DATA PRINTED CIRCUITS PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITYFEATURES PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOTOTHERWISE PROVIDED FOR RECOGNITION OF DATA RECORD CARRIERS SEMICONDUCTOR DEVICES SPECIAL PRINTED MATTER TRANSPORTING
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Beschreibung
Zusammenfassung:	An IC card includes a main substrate and a plurality of sub-substrates. Each sub-substrate has two surfaces on which electronic components are installed. The sub-substrates are mounted on both surfaces of the main substrate within the IC card. Openings in the main substrate receive electronic components installed on the sub-substrates. Such an arrangement makes it possible to provide four layers of electronic components within an IC card.