Pinned ceramic chip carrier

A ceramic chip carrier is disclosed which preferably includes a ceramic substrate having a circuitized surface, at least one semiconductor chip mounted on the circuitized surface, and at least one pin which is mechanically and electrically connected to a contact pad on the circuitized surface. Each...

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Bibliographische Detailangaben
Hauptverfasser:	MOORE, SCOTT P, SHRIVER, III, JOHN A, BRONSON, LANCE A
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A ceramic chip carrier is disclosed which preferably includes a ceramic substrate having a circuitized surface, at least one semiconductor chip mounted on the circuitized surface, and at least one pin which is mechanically and electrically connected to a contact pad on the circuitized surface. Each mechanical/electrical connection between a pin and a contact pad includes a conventional solder connection. In addition, each such solder connection is at least partially encapsulated in a material, including an epoxy resin, which is chosen in relation to the solder connection to enable the solder connection to withstand a standard thermal fatigue test.