Method for separating bonded substrates, in particular disassembling a liquid crystal display device

A method for separating bonded substrates which are prepared by facing a plurality of substrates and bonding the substrates by an adhesive features irradiating an energy beam on the bonding portions of the bonded substrates from above one of the bonded substrates to separate the one substrate and th...

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Hauptverfasser: TAKASAGO, HAYATO, GOFUKU, EISHI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A method for separating bonded substrates which are prepared by facing a plurality of substrates and bonding the substrates by an adhesive features irradiating an energy beam on the bonding portions of the bonded substrates from above one of the bonded substrates to separate the one substrate and the other substrate. The energy beam has the property of being transmitted through the one substrate and of being absorbed into the adhesive.