Sputtering cathode

The invention relates to a sputtering cathode for coating substrates in cathode sputtering apparatus, with a cathode base body 5, a target of nonmagnetic material disposed thereon and having at least one flat sputtering surface 9a, a magnet system 7 with pole faces 7c, 7d, of opposite polarity lying...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SICHMANN, EGGO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	The invention relates to a sputtering cathode for coating substrates in cathode sputtering apparatus, with a cathode base body 5, a target of nonmagnetic material disposed thereon and having at least one flat sputtering surface 9a, a magnet system 7 with pole faces 7c, 7d, of opposite polarity lying on both sides of the target margins for the production of a closed tunnel of magnetic lines of force overarching the sputtering surface 9a, while the pole shoes 23, 24, surrounding the target reach at least to the outer boundary of the target 9 or partially overlap the latter.