Wafer bonding process employing liquid oxidant
A bonding method including pressing a pair of slices together with a liquid oxidant therebetween and subjecting the pair of slices to a temperature to bond the slices together. Preferably a liquid oxidant is applied to one of the slices before they are pressed together and then dried. The heating st...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A bonding method including pressing a pair of slices together with a liquid oxidant therebetween and subjecting the pair of slices to a temperature to bond the slices together. Preferably a liquid oxidant is applied to one of the slices before they are pressed together and then dried. The heating step for bonding is carried out at a sufficiently high temperature of at least 1100 DEG C. to make the slices pliable so as to comply with each other during the bonding step. |
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