Direct application of unpackaged integrated circuit to flexible printed circuit

A method is described for electrically connecting flip chips to a flexible printed circuit substrate. The method comprises (1) providing solder paste to a plurality of active contact pads located on the flexible printed circuit substrate, (2) placing the flip chips on the substrate such that solder...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SELBITSCHKA, EUGENE T, CASSON, KEITH L, HABECK, KELLY D
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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