Direct application of unpackaged integrated circuit to flexible printed circuit

A method is described for electrically connecting flip chips to a flexible printed circuit substrate. The method comprises (1) providing solder paste to a plurality of active contact pads located on the flexible printed circuit substrate, (2) placing the flip chips on the substrate such that solder...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SELBITSCHKA, EUGENE T, CASSON, KEITH L, HABECK, KELLY D
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A method is described for electrically connecting flip chips to a flexible printed circuit substrate. The method comprises (1) providing solder paste to a plurality of active contact pads located on the flexible printed circuit substrate, (2) placing the flip chips on the substrate such that solder bumps located on the flip chips are in registration with the solder paste on the active contact pads, and (3) heating the resulting assembly as a whole so that the solder paste on each active contact pad reflows to form an electrical connection with its corresponding solder bump.