Totally enclosed hermetic electronic module

A hermetic module has a frame with an integral heat sink panel (20) extending thereacross between frame walls. High-density integrated circuit electronics (48, 50) are mounted on the heat sink panel (20) by hybrid assembly techniques. Covers (36, 38) are welded to the walls to achieve closure. A fee...

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Bibliographische Detailangaben
Hauptverfasser:	RUNYAN, MICHAEL D
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CURRENT COLLECTORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A hermetic module has a frame with an integral heat sink panel (20) extending thereacross between frame walls. High-density integrated circuit electronics (48, 50) are mounted on the heat sink panel (20) by hybrid assembly techniques. Covers (36, 38) are welded to the walls to achieve closure. A feedthrough (74) includes a connector block (84) extending through an opening (82) in a frame front bulkhead (76). The front bulkhead (76) is Kovar clad, and seal is achieved by means of a Kovar flexible seal (92) extending between the Kovar side of the front bulkhead (76) and a Kovar ring (86) on the connector block (84).