Mechanical lift-off process of a metal layer on a polymer

Mechanical lift-off process of a metal layer on a polymer

A lift-off process for removing a portion of a metal layer (4). The metal layer is formed on a dielectric polymer substrate with interposition of a corresponding portion of an intermediate layer (2). This process comprises the steps of selecting the material of the intermediate layer so that its int...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: TORRES, JOAQUIM, SCHILTZ, ANDRE, PALLEAU, JEAN
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A lift-off process for removing a portion of a metal layer (4). The metal layer is formed on a dielectric polymer substrate with interposition of a corresponding portion of an intermediate layer (2). This process comprises the steps of selecting the material of the intermediate layer so that its interface with the metal has a low adhesivity; applying to the structure a mechanical stress causing detachment of the metal at the interface; and chemically removing the intermediate layer.