Package for cascaded microwave devices

A lobed package for the protection and electrical connection of microwave devices is presented. The distinctive shape of the package allows several large devices to be connected in series in a coplanar arrangement. In the preferred embodiment, a base layer is formed into a trefoil shape with a central raised pedestal. Three wafer sized modules are cut to fit together at 120 DEG angles and are placed on the pedestal and electrically interconnected. A retaining shim is placed around the outside of the modules. An intermediate spring retaining plate with a recessed three-lobed well is placed atop the modules. Springs are placed in holes in the retaining plate. The springs are compressed by a cover plate placed on top of the retaining plate. Electrical connections are made to the cascaded device through the base or edge of the package. One application is to packaging three delay lines in series, each device occupying most of the space of a standard wafer.