Mold assembly with separate encapsulating cavities

A duo-cavity multigang pot molding assembly (10) for encapsulating semiconductor devices having an annular cavity (11) to form a molded carrier ring and an inner cavity (12) adapted to receive the item to be encapsulated. An outer mold pot (16) provides encapsulating material for the annular cavity...

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Bibliographische Detailangaben
Hauptverfasser:	ELLIOTT, ALEXANDER J
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	A duo-cavity multigang pot molding assembly (10) for encapsulating semiconductor devices having an annular cavity (11) to form a molded carrier ring and an inner cavity (12) adapted to receive the item to be encapsulated. An outer mold pot (16) provides encapsulating material for the annular cavity (11) whereas a separate mold pot (17) provides encapsulating material for the inner cavity (12). Encapsulating material for the mold pots (16, 17) may be the same or in a preferred embodiment, different. Molding apparatus (10) promotes improved process control by delivering encapsulating material with a lower and more uniform viscosity to both the annular cavity (11) and the inner cavity (12). Further, use of separate mold pots (16, 17) allows cost savings because a less expensive encapsulating material may be used for molding the molded carrier ring since a high purity encapsulating material is not needed.