Method for lapping two surfaces of a titanium disk

A method for lapping two surfaces of a titanium disk comprises inserting loosely a titanium disk to be lapped into an opening in a disk-type carrier, the carrier rotating and revolving between an upper surface plate and a lower surface plate which are held in parallel with each other and which appli...

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Bibliographische Detailangaben
Hauptverfasser:	TAKEUCHI, HIROYOSHI, TAKAGI, MASAKUNI, MINAKAWA, KUNINORI, SUENAGA, ITO, TAKESHI, FUKAI, HIDEAKI
Format:	Patent
Sprache:	eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING
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Beschreibung
Zusammenfassung:	A method for lapping two surfaces of a titanium disk comprises inserting loosely a titanium disk to be lapped into an opening in a disk-type carrier, the carrier rotating and revolving between an upper surface plate and a lower surface plate which are held in parallel with each other and which applies lapping pressure to the titanium disk, feeding abrasives between the surface plates and the titanium disk and satisfying the following relationship between thickness t (mm) of the titanium disk and thickness T (mm) of the carrier: 0.025 exp (t+1.5)