ROTARY SPUTTERING CATHODE

A vacuum sputtering cathode has a hollow structure (2) able to rotate about its axis and a magnetic confinement circuit (3) arranged peripherally about said structure. The cathode according to the invention is particularly suitable for the rapid dissipation of the thermal energy given off by the spu...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	DEVIGNE, ROLAND, BEAUFAYS, JEAN-PIERRE
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A vacuum sputtering cathode has a hollow structure (2) able to rotate about its axis and a magnetic confinement circuit (3) arranged peripherally about said structure. The cathode according to the invention is particularly suitable for the rapid dissipation of the thermal energy given off by the sputtering process and in particular for the sputtering of metals with a low melting point.