Matched impedance vertical conductors in multilevel dielectric laminated wiring

Electrical impedance matching for through plane connections or vias in a multiplane laminated wiring structure is provided by arranging the vias in patterns conforming to a standard characteristic impedance configuration. The pattern may be a five wire configuration with four vias surrounding the fi...

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Bibliographische Detailangaben
Hauptverfasser: CHANCE, DUDLEY A
Format: Patent
Sprache:eng
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Zusammenfassung:Electrical impedance matching for through plane connections or vias in a multiplane laminated wiring structure is provided by arranging the vias in patterns conforming to a standard characteristic impedance configuration. The pattern may be a five wire configuration with four vias surrounding the fifth and repeated over the area of the plane.