Jaw cleaving device

An apparatus and method for cleaving GaAs laser bars from a cell utilizes a first jaw applied to one end of a laser bar to propagate a cleavage and a second jaw applied to an opposite end which provides a biasing force that assures separation of the bar from the cell along the same crystallographic...

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Bibliographische Detailangaben
Hauptverfasser:	BAUER, TIBOR L, RUCKEL, RAYMOND R, LINNELL, DAVID C, CAVALIERE, WILLIAM A
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DEVICES USING STIMULATED EMISSION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES TRANSPORTING WORKING CEMENT, CLAY, OR STONE WORKING STONE OR STONE-LIKE MATERIALS
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Beschreibung
Zusammenfassung:	An apparatus and method for cleaving GaAs laser bars from a cell utilizes a first jaw applied to one end of a laser bar to propagate a cleavage and a second jaw applied to an opposite end which provides a biasing force that assures separation of the bar from the cell along the same crystallographic plane. The apparatus may be used in an ultra-high vacuum environment and allows handling of the bars without contacting the vital areas of the top surfaces or facet faces. The apparatus precisely locates bars after cleavage so that they may be further processed.