Method for producing multi-layer ceramic substrates with oxidation resistant metalization

Ceramic substrates and a method for forming the ceramic substrates containing multi-level and interconnected circuit patterns of copper based conductors which are resistant to oxidation, said formation includes burn-out of binders in air. The oxidation resistant copper based conductors are composed...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	CHANCE, DUDLEY A, HOUGHAM, GARETH G, GOLAND, DAVID B
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	Ceramic substrates and a method for forming the ceramic substrates containing multi-level and interconnected circuit patterns of copper based conductors which are resistant to oxidation, said formation includes burn-out of binders in air. The oxidation resistant copper based conductors are composed primarily of copper and additives such as zinc, platinum and chrome.