Method of repairing printheads and product thereof

A method of repairing a spent printhead or printhead subassembly and a repaired printhead or printhead subassembly made in accordance with such method is disclosed. The method includes the steps of removing the print pins from the spent printhead or printhead subassembly, removing at least a portion of the nose section in the area of the print pin holes of the spent printhead or printhead subassembly, filling at least a portion of such removed portion of the nose section with a casting material, inserting guide wires into the print pin holes in the nose section and permitting the casting material to at least partially cure to form new print pin holes. Also disclosed is a printhead or printhead subassembly repaired from a spent printhead having original print pin holes, the repaired printhead having a first section which includes a plurality of original print pin holes and a second section which includes a plurality of repaired print pin holes, the original print pin holes and repaired print pin holes being in alignment so as to form a plurality of composite print pin holes in the nose section, and a plurality of print pins arranged in the plurality of composite print pin holes so as to be selectively extendable beyond the print surface with the guidance of the repaired print pin holes of the second section.