Tape automated bonding system which facilitate repair

An interconnection system and method for linking electronic devices such as semiconductor chips. Inner leads of a tape automated bonding frame are aligned with pads on the semiconductor chip. Inner lead bonding fixes the lead frame to the chip. Outer leads of the tape automated bonding frame are brought into an overlapping relationship with conductive traces on a substrate. Rather than microbonding the outer leads to the traces of the substrate, bond wires are attached to the outer leads and the traces, thereby allowing electrical communication of input and output signals therebetween. In one embodiment, the tensile strength of the bond wires is greater than that of the outer leads. In a second embodiment, the bond strength of the wire to the outer lead is greater than the bond strength of the wire to the substrate trace.