High temperature metallization system for contacting semiconductor materials

A metallization system for contacting semiconductor materials employed in high temperature applications that is thermally stable. The system can be utilized in the fabrication of electronic devices such as diodes, lasers, transistors, solar cells, and integrated circuits comprised of such devices.

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Bibliographische Detailangaben
Hauptverfasser: DINGLE, JASON E, SPITZER, MARK B
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A metallization system for contacting semiconductor materials employed in high temperature applications that is thermally stable. The system can be utilized in the fabrication of electronic devices such as diodes, lasers, transistors, solar cells, and integrated circuits comprised of such devices.