Multilayer substrate with inner capacitors

A multilayer substrate with inner capacitors comprising a dielectric layer sandwiched between upper and lower insulating layers, a couple of printed electrodes in desired patterns within the thickness of the dielectric layer so as to form each capacitor at the portion of the dielectric layer corresponding to the electrodes, and a couple of leading terminals on one surface of the insulating layer, which communicate with the electrodes, the multilayer substrate being characterized in that the dielectric layer is composed of a ceramic composition mainly comprising MTiO3-based ceramics (M represents one or several of Ba, Ca, Mg, La, Sr and Nd) and the insulating layer is composed of a ceramic composition mainly comprising MgO-SiO2-CaO-based ceramics, which is defined by an area surrounded by the lines connecting points A, B, C, D, E, F and G as shown in FIG. 1 and listed below, wherein X, Y and Z respectively represent weight percent values of MgO, SiO2 and CaO at points A, B, C, D, E, F and G. -X Y Z -A 60 40 0 -B 40 60 0 -C 30 60 10 -D 30 50 20 -E 20 50 30 -F 40 30 30 -G 60 30 10 - With this multilayer substrate, the dielectric layer and the insulating layers can be co-fired. Therefore, cracking between the layers can be prevented and the superior insulation characteristics, such as insulation resistance and dielectric breakdown voltage, of the substrate can be maintained.