Solder-bump attached optical interconnect structure utilizing holographic elements and method of making same

An optical interconnect structure allows the transfer of data within a single integrated circuit as well as the interconnection of multiple integrated circuits. Opto-electronic transmitters and receivers which are fabricated under optimized conditions are coupled to planar optical waveguides. The planar optical waveguides incorporate holographic elements which direct optical emissions from the opto-electronic transmitters into the planar optical waveguide. Other holographic elements incorporated into the planar optical waveguides diffract these optical emissions out of the planar optical waveguide toward the opto-electronic receivers. The entire structure is fabricated and tested separately from the integrated circuits to be interconnected. The interconnect structure is then coupled to the integrated circuits by means of controlled collapse chip connection, or solder bump, technology.