Device for cooling regions with limited thermal exchange surface, in particular for electronic components

This device for cooling regions with limited thermal exchange surface, in particular for electronic components, comprises a body (2) made of thermally conducting material which internally defines a duct (4,7) for the passage of a refrigerating fluid and has a portion of its surface (3,6) associable with a region to be refrigerated; the passage duct has, for at least a portion of its extension, a circular cross section, and at this portion there is an injection nozzle (5,9) which is fed with pressurized refrigerating fluid so as to cause expansion of the refrigerating fluid in the passage duct. The injection nozzle is arranged in the body (2) with a delivery direction having a component which is tangent to the circumference of the cross section of the passage duct (4,7) to achieve a vorticose motion of the expanding refrigerating fluid about the axis (4a, 7a) of the passage duct, producing, by centrifugal force, a separation between liquid, which adheres to the wall, and vapor, which flows at the center of the passage duct, thus enhancing the thermal exchange between the fluid and the cooling surface.