Sputtering apparatus

A sputtering apparatus (10) in which the electrode (16) for supporting the substrates upon which thin magnetic films are to be deposited has a polygon-shaped planar coil (26) adjacent to a surface so that the coil can be energized to produce a uniform magnetic field at the surface of the substrates...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	CHENG, DAVID C, WILLIAMS, JOHN W, BONYHARD, PETER I, HENDRIX, HOWARD A, GLOVER, WILLIAM J, WARD, ERNEST S
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY INDUCTANCES INFORMATION STORAGE INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MAGNETS METALLURGY PHYSICS SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSFORMERS
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Beschreibung
Zusammenfassung:	A sputtering apparatus (10) in which the electrode (16) for supporting the substrates upon which thin magnetic films are to be deposited has a polygon-shaped planar coil (26) adjacent to a surface so that the coil can be energized to produce a uniform magnetic field at the surface of the substrates which is oriented normal to the polygon faces of the coil. This apparatus produces uniform easy axis of the thin magnetic films deposited on the substrates during relative motion between the substrates and the target electrode (14).