Method of producing IC cards

A method of producing an IC card in which an IC module is embedded, the method including preparing at least one first resin core sheet having a through hole at a position at which the IC module is to be embedded and at least one second resin core sheet having no hole at a position corresponding to t...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KODAI, SYOJIRO
Format:	Patent
Sprache:	eng
Schlagworte:	BOOK COVERS BOOKBINDING CALCULATING COMPUTING COUNTING DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDEDFOR FILES HANDLING RECORD CARRIERS LOOSE LEAVES MOVABLE-STRIP WRITING OR READING APPARATUS PERFORMING OPERATIONS PHYSICS PRESENTATION OF DATA PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITYFEATURES PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOTOTHERWISE PROVIDED FOR RECOGNITION OF DATA RECORD CARRIERS SPECIAL PRINTED MATTER TRANSPORTING
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Beschreibung
Zusammenfassung:	A method of producing an IC card in which an IC module is embedded, the method including preparing at least one first resin core sheet having a through hole at a position at which the IC module is to be embedded and at least one second resin core sheet having no hole at a position corresponding to the through hole, disposing adhesive sheet having an area greater than that of the through hole on the first resin core sheet covering the through hole, superposing the first and second resin core sheets with the adhesive sheet therebetween, fitting the IC module into the through hole of the first resin core sheet, heating and pressing the IC module and the resin core sheets to form an integral structure, and applying at least one surface protection sheet to the integral structure to complete the card.