Balancing putty

A balancing putty for use in balancing rotation of a rotary part including: (a) an epoxy resin; (b) a curing agent capable of curing the epoxy resin when heated at a temperature of 60 DEG C. or more, (c) a first, finely divided inorganic filler having a specific gravity of 4.0 g/cm3 or more; and (d)...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MATSUZAKI, KUNIMITSU, IBE, HIROMITU, AKUTAGAWA, ICHIRO
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A balancing putty for use in balancing rotation of a rotary part including: (a) an epoxy resin; (b) a curing agent capable of curing the epoxy resin when heated at a temperature of 60 DEG C. or more, (c) a first, finely divided inorganic filler having a specific gravity of 4.0 g/cm3 or more; and (d) a second, finely divided inorganic filler having a specific gravity of less than 4.0 g/cm3, the balancing putty having a density of at least 2.0 g/cm3 and a consistency of 1-12 mm in terms of penetration.