System and method for vacuum deposition of thin films

A vacuum evaporation plasma plating system (28) is disclosed in which the plasma (37) and the crucible (17,17A) containing the evaporant material (44) are part of an electrical circuit which effects vacuum evaporation operation. The crucible (17,17A) includes a constant anode cap (18,18A) which is h...

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Bibliographische Detailangaben
Hauptverfasser:	TEMPLE, MICHAEL D, SEDDON, RICHARD I
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A vacuum evaporation plasma plating system (28) is disclosed in which the plasma (37) and the crucible (17,17A) containing the evaporant material (44) are part of an electrical circuit which effects vacuum evaporation operation. The crucible (17,17A) includes a constant anode cap (18,18A) which is heated by the plasma (37) and thus maintains a low resistance circuit path to the crucible and also provides a uniform source (39) of evaporant.