Die apparatus

Apparatus and a method for processing work pieces, such as semiconductor lead frames, wherein the apparatus includes a power device such as a solenoid assembly, for driving an upper die into processing relationship to a work piece on a lower die with the stroke of the power device being relatively short, such as in the range of 0 to 0.375 inch. This is achieved by providing a second power device, such as a piston and cylinder assembly, in which the piston rod of the assembly raises the upper die high enough to allow clearance between the dies for the passage of the work piece between the dies, then the second power device is allowed to lower relatively slowly until the upper die is substantially in proximity to the work piece. When this occurs, the first power device is ready to be actuated and, when so actuated, moves a relatively short distance during the power stroke to process the work piece between the dies with a minimum of noise because of the greatly reduced distance of travel of the power device during the power stroke. In this way, the apparatus is more effectively used in the presence of one or more workmen so that there will be no injury to their hearing because of the greatly reduced noise levels associated with the improved die apparatus of the present invention.