Method for wafer treating

A processing apparatus and method utilizing a single process chamber to remove organics and metallic contaminates, remove native oxides, oxidize by heat and a oxidizing source, depositing a layer over the oxide formed with the capability of providing an source of additional ultraviolet light.

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Bibliographische Detailangaben
Hauptverfasser:	FREEMAN, DEAN W, DAVIS, CECIL J, LOEWENSTEIN, LEE M, BURRIS, JAMES B
Format:	Patent
Sprache:	eng
Schlagworte:	AGRICULTURE ANIMAL HUSBANDRY FISHING FORESTRY HUMAN NECESSITIES HUNTING PARTS, DETAILS, OR ACCESSORIES OF AGRICULTURAL MACHINES ORIMPLEMENTS, IN GENERAL SOIL WORKING IN AGRICULTURE OR FORESTRY TRAPPING
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Beschreibung
Zusammenfassung:	A processing apparatus and method utilizing a single process chamber to remove organics and metallic contaminates, remove native oxides, oxidize by heat and a oxidizing source, depositing a layer over the oxide formed with the capability of providing an source of additional ultraviolet light.