Process for preparing a printed-circuit board

Disclosed is a process for preparing a printed-circuit board, which process comprises the steps of: (a) subjecting a copper plated laminated, insulative plate for use in a printed circuit and having through-holes to electrodeposition coating in a photo-curable electrodeposition coating composition b...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KONDO, TOSHIO, KINAGA, YOSHIMASA
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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