Process for preparing a printed-circuit board

Disclosed is a process for preparing a printed-circuit board, which process comprises the steps of: (a) subjecting a copper plated laminated, insulative plate for use in a printed circuit and having through-holes to electrodeposition coating in a photo-curable electrodeposition coating composition bath to form a resist film on the surface of a copper foil of the copper plated laminated insulative plate; (b) lapping a wiring pattern mask on the resist film so that a through-hole wall area may form an exposed area; (c) exposing the resist film to ultraviolet light through the lapped wiring pattern mask; (d) removing the wiring pattern mask from the resist film; (e) exposing the resist film in the through-hole wall area to ultraviolet light through an optical fiber; (f) removing the resist film not exposed under the wiring pattern mask; (g) etching away the exposed copper foil; and (h) removing the etching resist pattern film.