Tailorable multi-layer printed wiring boards of controlled coefficient of thermal expansion

Disclosed are improved laminates useful in the manufacture of multi-layer printed wiring boards (MLPWB) and laminates. Such improved composites contain at least one layer which is formed from a liquid crystal polymer selected from the group consisting of poly(para-phenylene benzobisthiazole), poly(p...

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Bibliographische Detailangaben
Hauptverfasser: ZAKRAYSEK, LOUIS, BELKE, ROBERT E, PILLAR, WALTER O
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:Disclosed are improved laminates useful in the manufacture of multi-layer printed wiring boards (MLPWB) and laminates. Such improved composites contain at least one layer which is formed from a liquid crystal polymer selected from the group consisting of poly(para-phenylene benzobisthiazole), poly(paraphenylene benzobisoxazole), poly(2,5-benzothiazole), poly(2,5-benzoxazole), and mixtures thereof. The presently preferred liquid crystal polymer comprises poly(para-phenylene benzobisthiazole). The negative coefficient of thermal expansion and high modulus of elasticity of the liquid crystal polymers enable a laminate and MLPWB to be manufactured therefrom having a tailored coefficient of thermal expansion, broadly ranging from about 0 to 15 ppm/ DEG C. MLPWBs constructed of polymeric core layers also are possible utilizing the preferred liquid crystal polymers of the present invention.