Method of making pre-formed lead-ins for an IC package

Lead-ins for IC packages are pre-formed before attachment to a package substrate. The process comprises forming lead-in segments in continuous strip with the lead-ins being maintained in position by oppositely disposed, removable rails. A segment is separated from the strip and one end of the lead-i...

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Bibliographische Detailangaben
Hauptverfasser:	ORBANIC, ROBERT S, JOHNSON, ROBERT R
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Beschreibung
Zusammenfassung:	Lead-ins for IC packages are pre-formed before attachment to a package substrate. The process comprises forming lead-in segments in continuous strip with the lead-ins being maintained in position by oppositely disposed, removable rails. A segment is separated from the strip and one end of the lead-ins is formed into, e.g., a "J" shape. One rail is removed during the forming process. The last rail is not removed until the segment is mounted upon a substrate.