Wire scribed circuit boards and method of manufacture

Wire scribed circuit boards and method of manufacture

This invention relates to interconnection circuit boards and processes for making and modifying interconnection circuit boards wherein adhesive is applied to a wire used in scribing a conductor pattern. The adhesive is activated to a tacky state during the wire scribing operation which forms the con...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: CROWELL, JONATHAN C, MORINO, RONALD, KEOGH, RAYMOND J, SCHOENBERG, ANDREW J, FRIEDRICH, MARJU L, SWIGGETT, BRIAN E, SZENCZY, GEORGE
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:This invention relates to interconnection circuit boards and processes for making and modifying interconnection circuit boards wherein adhesive is applied to a wire used in scribing a conductor pattern. The adhesive is activated to a tacky state during the wire scribing operation which forms the conductor pattern, and can thereafter be cured to permanently bond the conductors to the board surface.