Semiconductor device

A semiconductor element mounting member which is a mounting portion of a lead frame is provided with a concave portion having a smaller area than that of the lower surface of a semiconductor element, the area being less than 4x4 mm2. The concave portion is filled with a bonding material, and the sem...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	FUKUDOME, KATSUYUKI, MORI, RYUICHIRO, BANJO, TOSHINOBU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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