Semiconductor device
A semiconductor element mounting member which is a mounting portion of a lead frame is provided with a concave portion having a smaller area than that of the lower surface of a semiconductor element, the area being less than 4x4 mm2. The concave portion is filled with a bonding material, and the sem...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A semiconductor element mounting member which is a mounting portion of a lead frame is provided with a concave portion having a smaller area than that of the lower surface of a semiconductor element, the area being less than 4x4 mm2. The concave portion is filled with a bonding material, and the semiconductor element and the semiconductor element mounting member are bonded by the bonding material. |
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