Fabrication of bonded structures

Bonding pressure is uniformly applied to the lay-up (70) of a bonded product (10) by the disposition of flexible, compressible, perforated sheet material (85) between the lay-up and a pair of molds (75 and 80) during the manufacture of the product by diffusion bonding.

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Bibliographische Detailangaben
Hauptverfasser: STOLTZE, LEON, NUTTER, JR., HARRY A, GRAFF, JOHN M
Format: Patent
Sprache:eng
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Zusammenfassung:Bonding pressure is uniformly applied to the lay-up (70) of a bonded product (10) by the disposition of flexible, compressible, perforated sheet material (85) between the lay-up and a pair of molds (75 and 80) during the manufacture of the product by diffusion bonding.