4.6/4.I copolyamide and a process for the preparation thereof

The invention relates to a copolyamide for application in films with improved barrier properties. The copolyamide containing tetramethyleneadipamide and tetramethylene-isophtalamide in a ratio between 9 : 1 and 1 : 9 and a relative viscosity of at least 2.0, and a process for the production of the c...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	ROERDINK, EIZE, WARNIER, JEAN M. M
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The invention relates to a copolyamide for application in films with improved barrier properties. The copolyamide containing tetramethyleneadipamide and tetramethylene-isophtalamide in a ratio between 9 : 1 and 1 : 9 and a relative viscosity of at least 2.0, and a process for the production of the copolyamide. Preferably the copolyamide contains a small amount of a compound that induces the formation of networks between the polyamide chains.