Low profile semiconductor package
A flat thin package for semiconductor die has rigid leads extending perpendicularly from its length which can be plugged into a printed circuit board socket. The package has a low profile above the surface of the printed circuit board.
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A flat thin package for semiconductor die has rigid leads extending perpendicularly from its length which can be plugged into a printed circuit board socket. The package has a low profile above the surface of the printed circuit board. |
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