Bonding method and apparatus

An apparatus for reflowing solder terminals that join an electronic element to a support substrate, which apparatus includes (1) a stage for supporting the substrate, (2) a quantity of liquid capable of being heated to a temperature in excess of the melting point of the solder of the solder terminal...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	LIPSCHUTZ, LEWIS D
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	An apparatus for reflowing solder terminals that join an electronic element to a support substrate, which apparatus includes (1) a stage for supporting the substrate, (2) a quantity of liquid capable of being heated to a temperature in excess of the melting point of the solder of the solder terminals, (3) a means to contact a surface of the substrate with the liquid, including a reservoir for maintaining the liquid, and a pumping means to move the liquid from the reservoir into contact with the surface of the substrate, and (4) a means to control the temperature of the liquid when in contact with the substrate to initially increase the temperature of the liquid, and subsequently reduce the temperature of the liquid.