Flexible electrical connection and method of making same

A flexible electrical connection, and method for making such a connection, for mounting an electronic device, such as a semiconductor chip made primarily of silicon, on an organic substrate, such as a printed circuit board made of a glass material impregnated with epoxy resin, are disclosed. The fle...

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Bibliographische Detailangaben
Hauptverfasser:	CANESTARO, MICHAEL J, SUMMA, WILLIAM J
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE
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Beschreibung
Zusammenfassung:	A flexible electrical connection, and method for making such a connection, for mounting an electronic device, such as a semiconductor chip made primarily of silicon, on an organic substrate, such as a printed circuit board made of a glass material impregnated with epoxy resin, are disclosed. The flexible electrical connection comprises a circuit line attached to the surface of the organic substrate and having a floating terminus in a relatively low adhesive area of the organic substrate where it is desired to mount the electronic device on the organic substrate. The floating terminus includes a stress relief bend, and the flexible electrical connection relieves stresses, such as thermal stresses, which may otherwise damage the physical and/or electrical connection between the electronic device and the floating terminus of the flexible electrical connection when the electronic device is mounted on the surface of the organic substrate.