Method of making high strength paperboard panel

A method of producing paperboard and a paperboard structure wherein the grain lines of upper and lower chipboard panels are aligned at right angles in relation to the undulations formed in a midstratum layer to yield an overall panel assembly having a high degree of bending resistance. The invention...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	CLINE, THOMAS L
Format:	Patent
Sprache:	eng
Schlagworte:	GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS IMPREGNATING OR COATING OF PAPER LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNERANALOGOUS TO PAPER MECHANICAL WORKING OR DEFORMATION OF PAPER, CARDBOARD ORMATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER PAPER NOT OTHERWISE PROVIDED FOR PAPER-MAKING PERFORMING OPERATIONS PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D PRODUCTION OF CELLULOSE PULP COMPOSITIONS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TEXTILES TRANSPORTING TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G WORKING PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUSTO PAPER
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Beschreibung
Zusammenfassung:	A method of producing paperboard and a paperboard structure wherein the grain lines of upper and lower chipboard panels are aligned at right angles in relation to the undulations formed in a midstratum layer to yield an overall panel assembly having a high degree of bending resistance. The invention also relates generally to a panel method of assembly having a particular novel layered construction. In place of a conventional solid chipboard laminated construction, an undulated midstratum layer is utilized in such manner that air cells or pockets are formed within the structure. An overlayer and an underlayer are adhesively applied to the undulated midstratum layer. The invention results in a panel assembly which may be much more economically manufactured while yielding superior end product strength and durability. The invention has widespread utility as a superior substitute for the currently used solid laminated chipboard design.