High reliability metal and resin container for a semiconductor device

A container for a semiconductor device has a metal plate and a body of synthetic resin which encapsulates a part of the plate, keeping a large surface thereof exposed. In the area separating the part encapsulated within the body of resin and the part without the resin, the plate has two opposed side...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: COLOMBO, PIERO, CELLAI, MARINO, COGNETTI DE MARTIIS, CARLO
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A container for a semiconductor device has a metal plate and a body of synthetic resin which encapsulates a part of the plate, keeping a large surface thereof exposed. In the area separating the part encapsulated within the body of resin and the part without the resin, the plate has two opposed side notches and at least one groove connecting them.