Method and apparatus for controlling the organic contamination level in an electroless plating bath

An electroless plating bath is selectively cleaned of organic contaminants. The organic contaminants are detected by measuring the capacitance between a working electrode and counter electrode with a potentiostat. The capacitance measurements are used to indicate the level of organic contaminants. E...

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Bibliographische Detailangaben
Hauptverfasser:	MCBRIDE, DONALD G, RICKERT, ROBERT G
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	An electroless plating bath is selectively cleaned of organic contaminants. The organic contaminants are detected by measuring the capacitance between a working electrode and counter electrode with a potentiostat. The capacitance measurements are used to indicate the level of organic contaminants. Exposure of the dummy plating surface in the electroless plating bath is controlled such that the exposed surface is directly proportional to the detected level of organic contaminants.