Surface mount socket for dual in-line package

Surface mount socket for dual in-line package

A surface mounting socket suitable for use with dual in-line circuit packages and printed circuit boards adapted only for surface mounting is disclosed. The socket has a plurality of terminals each having perpendicular sections which form a compliant termination to a surface mounting pad on the prin...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: MCCLUNE, DONALD W, KUNKLE, JOHN P
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:A surface mounting socket suitable for use with dual in-line circuit packages and printed circuit boards adapted only for surface mounting is disclosed. The socket has a plurality of terminals each having perpendicular sections which form a compliant termination to a surface mounting pad on the printed circuit board. Each terminal is compliant about a longitudinal force along two orthogonal axes and is compliant in response to a torsional moment about a third orthogonal axis.