Plated parts and their production

Plated metal parts, such as sealing lids for semiconductor packages, in which an iron-based alloy layer is electroplated with a first layer of nickel, a first layer of gold is electroplated on the first nickel layer, a second layer of nickel is electroplated onto the first gold layer and a second la...

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Bibliographische Detailangaben
Hauptverfasser:	LEVINE, SAMUEL W
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY PERFORMING OPERATIONS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TRANSPORTING
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Beschreibung
Zusammenfassung:	Plated metal parts, such as sealing lids for semiconductor packages, in which an iron-based alloy layer is electroplated with a first layer of nickel, a first layer of gold is electroplated on the first nickel layer, a second layer of nickel is electroplated onto the first gold layer and a second layer of gold is electroplated onto the second layer of nickel. The resultant plated parts exhibit higher salt atmosphere corrosion resistance than parts plated with a single nickel-gold set. Other metals can be used as the plating layers.