Waste gas exhaust system for vacuum process apparatus

An exhaust system utilizes a booster pump and an auxiliary pump of vacuum process apparatus which vacuum treats a substrate with gases of the chlorine series. A vessel of the auxiliary pump on the air exhaust side is filled with an inert gas of a pressure higher than the atmospheric pressure, and a...

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Bibliographische Detailangaben
Hauptverfasser:	ASHAISHI, ISHAO, TSUKADA, TSUTOMU, KOIZUMI, TATSUNORI, IKEDA, KOUJI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUSPOLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS BLASTING CHEMISTRY CRYSTAL GROWTH ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEATING LIGHTING MECHANICAL ENGINEERING METALLURGY NON-POSITIVE DISPLACEMENT PUMPS PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITHDEFINED STRUCTURE PUMPS PUMPS FOR LIQUIDS OR ELASTIC FLUIDS REFINING BY ZONE-MELTING OF MATERIAL ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENTMACHINES FOR LIQUIDS ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENTPUMPS SEMICONDUCTOR DEVICES SEPARATION SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITHDEFINED STRUCTURE SINGLE-CRYSTAL-GROWTH TRANSPORTING UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL ORUNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL WEAPONS
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Beschreibung
Zusammenfassung:	An exhaust system utilizes a booster pump and an auxiliary pump of vacuum process apparatus which vacuum treats a substrate with gases of the chlorine series. A vessel of the auxiliary pump on the air exhaust side is filled with an inert gas of a pressure higher than the atmospheric pressure, and a dry adsorption column capable of adsorbing the gases of the chlorine series is connected to an air exhaust pipe of the auxiliary pump. Further, a dust trap having a cooling surface is provided between the booster pump and the auxiliary pump, and the wall surface of the gas passage between the booster pump and the auxiliary pump is heated.