Thermostatic electric switch and thermal biasing assembly therefor

A housing has a switch chamber in which an electric switch is placed and a recess in which is received a snap acting, thermally responsive disc which actuates and deactuates the switch upon snapping from one configuration to another. A drop in thermal biasing assembly used to modify the operating temperature of the disc has a pair of cylindrical film type resistors electrically connected in parallel circuit relation and physically connected to a pair of connectors. An assembly having resistors of a rating chosen for a particular application is dropped into the recess before the disc is assembled, the connectors sliding into matching bores formed in the housing. The connectors are attached to suitable teminals and the disc is then placed over the thermal biasing assembly to provide a multiple temperature operating thermostat.