Catalyst composition for forming electroless plating on ceramics

PCT No. PCT/JP85/00128 Sec. 371 Date Nov. 15, 1985 Sec. 102(e) Date Nov. 15, 1985 PCT Filed Mar. 14, 1985.A composition for forming electroless plating on ceramics which comprises (i) 1 weight part of at least one member selected from the group consisting of organic palladium compounds and organic s...

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Hauptverfasser:	ARISATO, YASUNORI, MORITSU, YUKIKAZU, AKAI, YOSHITO, KONAGA, NOBUYUKI, WADA, MASATOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	ARTIFICIAL STONE CEMENTS CERAMICS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS CONCRETE DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL LIME, MAGNESIA METALLURGY REFRACTORIES SLAG SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TREATMENT OF NATURAL STONE
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Zusammenfassung:	PCT No. PCT/JP85/00128 Sec. 371 Date Nov. 15, 1985 Sec. 102(e) Date Nov. 15, 1985 PCT Filed Mar. 14, 1985.A composition for forming electroless plating on ceramics which comprises (i) 1 weight part of at least one member selected from the group consisting of organic palladium compounds and organic silver compounds, (ii) 0.1 to 200 weight parts of at least one member selected from the group consisting of organic metal compounds, (iii) 10 to 1000 weight parts of an organic solvent and optionally (iv) 1 to 500 weight parts of at least one member selected from the group consisting of high molecular compounds and particulate inorganic substances.